Model : SWMS-1000S

Auto inspection of skeleton wafer with vision camera and image/map matching algorism applied.
By comparing scanned image and wafer map, user can easily verify the appropriation of die P&P work.
Reduce overall operation time taken for process related to skeleton wafer handling and management.

· Automatically detaches the film from wafer ring frame
   and then stack bare wafer frames
· 8” & 12” wafer can be applied
· Automatically recognizes the barcode
· Recognizes the notch direction
· Image acquisition by line scan camera