PRODUCT

WAFER INSPECTION SYSTEM II

Model :GWIS-WM1000S


· A Wafer Transfer Robot(WTR) capable of stable handling for wafer thicknesses
  below 200um, including Thinned & Warped Wafers
· A  Rubber Chuck & Warpage Minimizer to prevent Micro Bump Damage
  during Bumped Wafer Inspection
· Inspection of defects on the backside of wafers (cracks, chipping FM, BSC Void)
  using a 16K Line Scan high-resolution camera
· Inspection of Wafer Marking Alignment using Two-Way Scope cameras
  for simultaneous imaging of the Wafer Top and Bottom
 

· Load Port Module (8 & 12 Inch FOSB & Cassette)
· Wafer Transfer Robot (with Bernoulli Hand)
· Pre-Aligner (Wafer Notch Detection and Alignment)
· Wafer ID OCR (COGNEX IS1740 Series Reader)
· Minimizer and Rubber Chuck
  (Specific Design And ESD Material Applied )
· Flipper (With Bernoulli Hand)
· Wafer Defect Inspection
  (16K Line Scan Camera)
· Wafer Marking Alignment Inspection
  (Top & Bottom Dual Camera)


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(주)가온코리아  
광주광역시 광산구 월봉반월길 236  
지사 : 경기도 안산시 단원구 신길동 1229
리드스마트스퀘어 지식산업센터 773호
Korean : 070-4880-3613  
English : 062-419-3622  
FAX : 0505-300-4613
사업자등록번호 : 409-86-44984  
대표 : 김도헌  개인정보책임자 : 박아연

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