Model : WMA-1000S
 

It automatically loads wafer and inspects wafer die marking
alignment and shift.

· Supports auto calibration function using software
· Shows the merged image of wafer and backside
   marking on dies
· Auto wafer pre-align with notch finder camera
· Uses minimizer to alleviate wafer warpage
· Applies to 8”, 12” Wafer
· Minimizer is equipped with fluorine pad to prevent
  any damage of wafer surface