PRODUCT

WAFER REFERENCE DIE MARKING SYSTEM

Model : WR-L1000


Acquires wafer image with the high-resolution line scan camera
to prevent operator's mistake by matching the high-resolution
image and wafer map data, then mark on the reference dies.

· Automatically recognizes the first die position in wafer
· Process : Before Die Attach, Chip Attach Processes
· Applies to 8”, 12” Wafer
· Determine reference die location based on wafer map
· Automatic recognition of bin code of wafer map
· Recognizes the notch direction
· Laser marking on correspond position of reference dies

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(주)가온코리아  
광주광역시 광산구 월봉반월길 236  
지사 : 경기도 안산시 단원구 신길동 1229
리드스마트스퀘어 지식산업센터 773호
Korean : 070-4880-3613  
English : 062-419-3622  
FAX : 0505-300-4613
사업자등록번호 : 409-86-44984  
대표 : 김도헌  개인정보책임자 : 박아연

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ALL RIGHTS RESERVED

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