Small Scaled Process Solutions
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DS200
  • Precision device that performs at room temperature dehumidification, dehumidification
  • Semi-permanent connection to a lower cost of ownership
  • Precision electronic assembly, suitable for the storage of semiconductors, HIC, PCB, etc.
  • Since already absorbed I.C Package is dehumidified when stored for more than 72 hours to prevent the Micro Dryer Micro-Crack
  • Dehumidification dehumidification and kept in such state board, multilayer board
  • Pre-Flux Pattern Film and moisture-proof storage for use in circuit board manufacturing processes Print
  • Prevent absorption of the powder material - dried at room temperature anti-oxidation liquid Glass substrate cleaning of electronic components