PRODUCT

REEL AUTO LABELING SYSTEM

WAFER MARKING ALIGNMENT INSPECTION SYSTEM

Model : WMA-1000S
 

It automatically loads wafer and inspects wafer die marking
alignment and shift.

· Supports auto calibration function using software
· Shows the merged image of wafer and backside
   marking on dies
· Auto wafer pre-align with notch finder camera
· Uses minimizer to alleviate wafer warpage
· Applies to 8”, 12” Wafer
· Minimizer is equipped with fluorine pad to prevent
  any damage of wafer surface 


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Gaon Korea   
236 Wolbong Banwol-gil, Gwangsan-gu,
Gwangju, South Korea   
Branch : Room 773, Lead Smart Square
Knowledge Industry Center, 1229 Singil-dong,
Danwon-gu, Ansan, Gyeonggi-do,
South Korea
Korean : 070-4880-3613  
English : +82-62-419-3622  
FAX : 0505-300-4613
Business Registration Number :
409-86-44984  
CEO : KIM DO HUN  
Personal Information Manager : Park A-yeon

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ALL RIGHTS RESERVED

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