Model : WR-L1000

Acquires wafer image with the high-resolution line scan camera
to prevent operator's mistake by matching the high-resolution
image and wafer map data, then mark on the reference dies.

· Automatically recognizes the first die position in wafer
· Process : Before Die Attach, Chip Attach Processes
· Applies to 8”, 12” Wafer
· Determine reference die location based on wafer map
· Automatic recognition of bin code of wafer map
· Recognizes the notch direction
· Laser marking on correspond position of reference dies