Full Automation Level Solutions
Acquires Wafer image with the High-Resolution Line Scan Camera to prevent operator's mistake by matching the high-resolution image and Wafer Map data, then mark on the Reference Dies.
  • Automatically recognizes the first Die position in Wafer
  • Process : Before Die Attach, Chip Attach Processes
  • Applies to 8”, 12” Wafer
  • Determine Reference Die location based on Wafer Map
  • Automatic recognition of Bin Code of Wafer Map
  • Recognizes the Notch direction
  • Laser marking on correspond position of Reference Dies