Acquires Wafer image with the High-Resolution Line Scan Camera to prevent operator's mistake by matching the high-resolution image and Wafer Map data, then mark on the Reference Dies.
Automatically recognizes the first Die position in Wafer
Process : Before Die Attach, Chip Attach Processes
Applies to 8”, 12” Wafer
Determine Reference Die location based on Wafer Map
Automatic recognition of Bin Code of Wafer Map
Recognizes the Notch direction
Laser marking on correspond position of Reference Dies
(주)가온코리아 I 광주광역시 광산구 월봉반월길 236 I 지사 : 인천광역시 남동구 은봉로 55 SD타워 709,710호 I Korean : 070-4880-3613 I English : +82-62-419-3615 I F.0505-300-4613
사업자등록번호 : 409-86-44984 I 대표 : 김도헌 I 개인정보책임자 : 박아연 Copyrightⓒ2022 GAON Co., Ltd. ALL RIGHTS RESERVED