Full Automation Level Solutions
- Wafer Reference
Die Marking System - Wafer Marking Alignment
Inspection System - Wafer Inspection
System - Skeleton Wafer
Management System - Skeleton Wafer
Inspection System
- Wafer Mark Align Inspection +
3D Profiler System - Pre-Soldering
Inspection System - 2D Map
Edit System - MEP Top Ball
Inspection System - MEP Top Chip&Component
Inspection System
Image
Video
Automatically loads Wafer and inspects Wafer Die, marking alignments and shifts.
- Supports Auto calibration function using software
- Shows the merged image of Wafer and backside marking on Dies
- Auto Wafer pre-align with Notch Finder Camera
- Uses minimizer to alleviate Wafer warpage
- Applies to 8”, 12” Wafer
- Minimizer is equipped with fluorine pad to prevent any damage of Wafer surface
