System inspects Frame Mounted Wafer after Wafer Dicing process. It also provides Automated Material Handling System to prevent any Wafer’s damage.
Wherever you want to see, just click on position, and look at the image displayed on the 2nd UI
Acquires image with the High-Resolution Line Scan Camera to compare actual scanned Wafer image with Wafer Map
Supports Wafer Map edit function and image saving function
Embedded vision camera in the microscope perfectly substitutes your naked eyes
Controlled by joystick, which supports various control modes (X/Y move, diagonal move and step move mode) and has versatile buttons (mainly used to edit Bin Code on Wafer Map)
(주)가온코리아 I 광주광역시 광산구 월봉반월길 236 I 지사 : 인천광역시 남동구 은봉로 55 SD타워 709,710호 I Korean : 070-4880-3613 I English : +82-62-419-3615 I F.0505-300-4613
사업자등록번호 : 409-86-44984 I 대표 : 김도헌 I 개인정보책임자 : 박아연 Copyrightⓒ2022 GAON Co., Ltd. ALL RIGHTS RESERVED