Full Automation Level Solutions
Auto inspection of Skeleton Wafer with Vision Camera and image/map matching algorism applied. By comparing scanned image and Wafer Map, user can easily verify the appropriation of Die P&P work. Reduce overall operation time taken for process related to Skeleton Wafer handling and management.
  • Automatically detaches the film from Wafer ring frame and then stack bare Wafer frames
  • Applies to 8”, 12” Wafer
  • Automatically recognizes the Barcode
  • Recognizes the Notch direction
  • Image acquisition by Line Scan Camera