Auto inspection of Skeleton Wafer with Vision Camera and image/map matching algorism applied. By comparing scanned image and Wafer Map, user can easily verify the appropriation of Die P&P work. Reduce overall operation time taken for process related to Skeleton Wafer handling and management.
Automatically detaches the film from Wafer ring frame and then stack bare Wafer frames
(주)가온코리아 I 광주광역시 광산구 월봉반월길 236 I 지사 : 인천광역시 남동구 은봉로 55 SD타워 709,710호 I Korean : 070-4880-3613 I English : +82-62-419-3615 I F.0505-300-4613
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