Full Automation Level Solutions
The system improves management method of storage and verification on Skeleton Wafers after D/P processing. Compares the scanned Skeleton Wafer image with Wafer Map File automatically and verify conformity of Die P&P process, such as Die Attach, Chip Attach and DPS.
  • Applies to 8”, 12” Wafer
  • Acquire the images of Skeleton Wafers using Line Scan Camera
  • Recognizes the Wafer Notch direction
  • Download Wafer Map file from FTP server
  • Matching the scanned image and Map data by overwrapping
  • P&P process verification by comparing image with Wafer Map data