Full Automation Level Solutions

Under Development

Wafer Level Unit marking alignment check and measure marking depth and width. Target Process: Wafer Level Marking in WLCSP, DPS and Bumping.
  • Wafer level marking alignment checking using Dual CCD
  • EFEM (Equipment Front End Module) Applied
  • Laser Scanning 3D Profiler for marking depth and width measurement
  • Measuring Scope: Over a 50 mm SQR area with nanometer resolution laser scanning microscope
  • Fully Automated Material Handling System Applied