Full Automation Level Solutions
- Wafer Reference
Die Marking System - Wafer Marking Alignment
Inspection System - Wafer Inspection
System - Skeleton Wafer
Management System - Skeleton Wafer
Inspection System
- Wafer Mark Align Inspection +
3D Profiler System - Pre-Soldering
Inspection System - 2D Map
Edit System - MEP Top Ball
Inspection System - MEP Top Chip&Component
Inspection System
- PCB Marking Alignment
Inspection&Tray 2DID System - SMT Nozzle
Inspection System - SMT Nozzle
Management System - PCB Magazine
Stocker - Panel Map
Edit System
- PCB Marking & Mapping System +
PCB Magazine Stocker - BOM & Tool Inventory
Management System - Wafer Pre-Aligner
using Mashine Vision
Image
Under Development
Wafer Level Unit marking alignment check and measure marking depth and width. Target Process: Wafer Level Marking in WLCSP, DPS and Bumping.
- Wafer level marking alignment checking using Dual CCD
- EFEM (Equipment Front End Module) Applied
- Laser Scanning 3D Profiler for marking depth and width measurement
- Measuring Scope: Over a 50 mm SQR area with nanometer resolution laser scanning microscope
- Fully Automated Material Handling System Applied
