Full Automation Level Solutions
- Wafer Reference
Die Marking System - Wafer Marking Alignment
Inspection System - Wafer Inspection
System - Skeleton Wafer
Management System - Skeleton Wafer
Inspection System
- Wafer Mark Align Inspection +
3D Profiler System - Pre-Soldering
Inspection System - 2D Map
Edit System - MEP Top Ball
Inspection System - MEP Top Chip&Component
Inspection System
Image
Video
Auto PCB marking alignment inspection after mold process. Acquire images of top and bottom of molded strip with a High-Resolution Line Scan Camera. Through diagnosing the area that marking shift frequently occurs, prevents marking shift related quality issue.
- Automatically inspects PCB marking shift by checking distance value
- Auto alignment by uploading specific align mark on PCB
- Vision Specification: 16K Line Scan Camera
- 2 areas setting to scan top and bottom of substrate at the same time
